tin solder

The ICP-AES Method for Determination of Lead and Tin in Tin Solder

ICP&AES法测定焊锡中锡、铅含量

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Joints between reinforcement members can be made satisfactorily with tin solder.

锡焊能够满意地做成加筋构件之间的接头.

词典精选例句

iPhone uses 100% recycled rare Earth elements in magnets and 100% recycled tin in the solder of the main logic board.

iPhone使用100%再生稀土元素来打造磁体，并在主板焊料中使用100%再生锡。

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Manual solder equipment, hand Baptist tin heater Tool Grinder, hands and feet all aircraft.

手动焊锡设备, 手浸锡炉,磨刀机, 手推切脚机.

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Inspection for Leadless Tin Solder by AOI

自动光学检验设备（AOI）对无铅焊锡的检测

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Extrusion Process and Design of segmental Die for Blank of Resin-cored Tin-lead Solder

锡铅焊丝坯挤压工艺及组合模具设计

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Tin Based Alloy Solder Powder for Free Cleaning Type Soldering Paste

免清洗型软钎膏用锡基合金焊粉

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ICP-AES determination of Cu Fe CD Zn Al and Bi as impurities in tin-lead solder

ICP-AES法测定锡铅焊料中铜铁镉锌铝铋

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To have lead tin line, tin bar and lead-free solder bar for line, the main products of excellent quality, china-largest of international brands.

以有铅锡线、锡条和无铅锡线、锡条为主要产品，倾力打造质量优良的国际品牌。

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When soldering ceramic radiating fins on electronic component such as powerful transistors for radio station, the silver film on the fins would be melted together with the tin solder and broken down.

电台用的电子部件如大功率晶体管等与陶瓷散热片焊接时，锡与银会共熔，银层从散热片上脱落。

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The method is proved to be accurate, reliable, convenient and quick, absolutely suitable for the assaying of trace lead in silver tin solder.

方法准确、可靠、简便、快速，完全适用于银锡焊料中微量铅的检验。

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The process is directly between the two types of metal welding, a solid solder joint appearance, there is no brittle fracture caused by tin solder, oxidation, solder false.

该工艺是两种金属之间直接熔接，焊点美观牢固，没有锡焊引起的脆裂、氧化、虚焊、假焊。

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The determination of copper, iron, aluminum and zinc in tin solder by ICP-AES method is reported in this paper.

本文以ICP-AES法测定焊锡中铜、铁、铝、锌。

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If only adjusting the size of flame to control the temperature of the hot airflow, it can solder whatever thick or thin plastic materials. Furthermore, tin head can be changed to carry out tin solder.

耐用，不易损坏，厚、薄塑料都能焊，只要调节火焰大小控制热气流温度就可以了，而且换上锡焊焊头还能进行锡焊。

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Application of Computer Graphic Technology in Measurement of Tin Solder Spreading Area

电脑图形处理技术在锡焊料铺展面积测量中的应用

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Determination of phosphorus in tin-lead solder

锡铅焊料中磷的测定

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The paper introduces the laser cut mould plate, the characteristics of tin solder and some problems which should be paid attention to in screen printing.

重点介绍了激光切割成型的模版、锡焊膏的特点及丝网印刷中应注意的问题。

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welding design of formwork can tsui on the molten solder flows tin solder formwork will not splash on stage in the job.

焊铁架之设计能把焊咀上的熔融锡流入焊铁架内，不会溅在工作台上。

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The determination of lead and tin in tin solder by ICP-AES method is given in this paper.

本文利用ICP-AES法进行焊锡中Sn、Pb含量的测定。

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We have determined tin and lead contents in tin solder using the XRF fundamental parameter method without standard sample in this paper.

本文在无标样的情况下，用X射线荧光基本参数法测定了焊锡中的锡和铅的含量。

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determination of stibium in tin solder by flame atomic absorption spectrometry

火焰原子吸收光谱法测定锡基焊料中锑

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